蓝宝石精密切割裂片机

Sapphire Material Cutting Machine

产品简介：

采用红外皮秒激光器，保证完美光束质量，光斑细，切割精度高。

IR picosecond laser is used to ensure perfect beam quality, fine spot and high cutting precision

产品亮点：

可兼容振镜和聚焦头两种裂片方式

Compatible with galvo and focusing head

兼容多款国内外激光器型号，可添加CCD定位等功能模块

Compatible with a variety of domestic and overseas laser models

Optional customized CCD solution and other functional modules can be added

高速XY运动平台，大程度提升加工速度

High speed XY platform ensures stability under high speed processing

可切割有油墨与镀膜蓝宝石

Minimum ink offset when cutting Sapphire with deco

实现无锥度切割，边缘光滑，崩边少

Realize no taper cutting, smooth edge and minimized chipping

性能参数：

应用领域：

0.3mm-5mm厚度光玻璃，手机盖板、手表盖板、玻璃logo的切割倒角工艺

0.3mm-2mm sapphire, phone cover, watch cover, camera protective glass, optic protective cover filamentation and separation